硅晶片,silicon wafer,国际买家全球采购商,免费世界求购信息

最新国际求购:硅晶片,silicon wafer
silicon wafer silicon wafersilicon waferxca001006 5" silicon wafer (standard 125mm) vt anyorientation 100one side polished 1 spdiameter 125mmthickness 22-25 milsxca000988 scrap wafer np dl 72727 material blank waferspart number dl72727description scrap pico wafers, altic material125mm round x 1.21mm thickwithout sequential serial id markingwafer form without aluminum, black colorxca001028 6" silicon wafer thermal oxide 1000am diameter 150.0 +/- 0.5 mmorientation (100) +/- 0.5 degthickness 650 - 700 umprimary flat (110) +/- 0.5mmsecondary flat nonegrade testtype p/boronresistivity 1-20 ohm-cmsurfacesingle side polishedflat length 57.5mm +/- 2.5mmpackaging 25 pieces/boxxca000069 2" silicon wafer w/ 1000a of tantalum coating pca # 9699type presistivity 0 - 20 ohmthickness 250-300 amstrongrade vt one side polisheddiameter 2" or 50mmta coating 1000 aorientation 100xca001034 2" silicon wafer thickness 250 -300 umtype pdiameter 100mmorientation 100xca000048 1" silicon wafer w/ germanium coating material single crystal optical grade gediameter 1" or 25mmtype n/sborientation polished/ etehed optical grade germanium wafer roundresistivity 0.5 to 40 ohm-cmsize 0.9750" + 0.0250 - 0.0150" diamin value 0.9600"max value 1.000"range 0.0400"thickness 198-260 umsurface front side polished / backside etched or groundxca000978 6" silicon thermal oxide 10000am pca # 9335part # s4pospgrade vttype p/boronorientation resistivity surface 1000a +/- 10%thickness 500 +/-25 umdiameter 150mmxca001289 5" silicon wafer (125mm +/- 0.2mm) diameter 125mmtype p/ boronresistivity 1 - 15 ohms cmthickness 600-650 umorientation particles etched backnotched waferxca000013 5" silicon wafer ( t - 0.5mm ) diameter 5" with orientation flatthickness 0.5mm + -?polishing required as ordinal semiconductor wafer productprocessfine washing required as ordinal semiconductor wafer product processparticle done by visual inspection, size 0.3 um, not over150 pcs excpet outer 5mm areaxca000014 5" silicon wafer ( t - 2.0mm ) diameter 125 + -1.0mm with orientation flatthickness 2.0mm + - 0.1mmparallelism less than 0.02mmpolishing mirror finished by polishingchip less than 1.0mm (each for width, length, depth)scratch less than ra 0.01mm / rmax 0.2mmcrack width and length not over 1.0mmchamfer with not over 1mm chamfer at outerpacking not required one by one packingpacking material expanded polystyrene, packed not over 100 pcspaseo de sta. rosa 3, sta. rosa, laguna, philippinescontact person ms. rhenren davidtelephone 63-49-5440767fax 63-49-5440768